- AIN substrate (Thermal conductivity 170 W/mK)
- Low capacitance
- High Insulation resistance between terminals
- Halogen free and lead free
- RoHS compliant
- Maintain electrical isolation from heatsinks
- Remove unwanted heat from hot component
HTJ
Introduction
General specifications
- Size _ 0603 to 2512
Part numbering system
Example
| HTJ | 0603 | 63 | R | Z |
| ①~③ | ④~⑦ | ⑧~⑨ | ⑩ | ⑪ |
①~③
| Code | Product Type |
| HTJ | Thermal Jumper Surface Mount Chip |
④~⑦
| Code | Size(lnch) |
| 0603 | |
| 0508 | |
| 0612 | |
| 1206 | |
| 1225 | |
| 2512 |
⑧~⑨
| Code | Substrate Thickness(mm) |
| 50 | 0.50 |
| 63 | 0.635 |
⑩
| Code | Package |
| R | Paper Taping |
| K | Embossed Taping |
⑪
| Code | Optional |
| Z | Default code |
Download
| Name | |
|---|---|
| HTJ Series |  HTJ_20250529.pdf |